Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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Authors

Juan Cepeda-Rizo

Juan Cepeda-Rizo

Jeremiah Gayle

Joshua Ravich

Subjects

Electronic Packaging Technology / Engineering / Civil Appareils Électroniques Extreme Environments Milieux Extrêmes Reliability Design And Construction Electronic Apparatus And Appliances Fiabilité Space Vehicles

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