Three-dimensional molded interconnect devices (3D-MID)

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Authors

Franke, Jörg Dipl.-Ing

Franke, Jörg Dipl.-Ing

Subjects

Integrated Circuits Molding Electrical & Computer Engineering Interconnects (Integrated Circuit Technology) Electrical Engineering Matières Plastiques Plastics Injection Molding Of Plastics Technology & Engineering Design And Construction

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