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Discover Multichip Modules (Microelectronics)
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Adhesive Joining & Coating Technology in Electronics Manufacturing
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Electronics packaging forum
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1995 International Symposium on Microelectronics
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Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
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Worldwide developments in MCP integration
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Advanced electronic packaging
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Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California
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Multichip module technology handbook
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Thermal management handbook
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27th International Symposium on Microelectronics
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Prevalent single chip packages for integrated circuit packages
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MCM C/mixed technologies and thick film sensors
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Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92
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Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
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4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing ; proceedings
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1997 International Symposium on Microelectronics
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Multi-chip module test strategies
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Introduction to system-on-package (SOP)
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Conceptual design of multichip modules and systems
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Proceedings 1999 International Symposium on Microelectronics
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Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998
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1993 IEEE Multi-Chip Module Conference, MCMC-93, March 15-18, 1993, Santa Cruz, California
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Proceedings
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Multichip module design, fabrication, and testing
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