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Stress induced phenomena in metallization
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Proceedings of the Symposium on Reliability of Metals in Electronics
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Electro-diffusion of ions
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Materials reliability in microelectronics IV
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Termodynamiczne podstawy magnetotermodyfuzji i elektrotermodyfuzji w ośrodku ciągłym
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Materials Reliability in Microelectronics V (Symposium Proceedings Series; Volume 391)
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O priblizhenii ėlektroneĭtralʹnosti v zadachakh ėlektrodiffuzii
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Electromigration in ULSI Interconnections
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Materials Reliability in Microelectronics II
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Electromigration behavior of a multi-layer metallization (Series in microelectronics)
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Ėlektrodiffuzionnai͡a︡ diagnostika techeniĭ v suspenzii͡a︡kh i polimernykh rastvorakh
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Advanced Ta-based diffusion barriers for Cu interconnects
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Electromigration in thin films and electronic devices
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The electromigration- and temperature-induced structural behavior of gold thin films based upon alkali additions
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Stress induced phenomena in metallization
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Submicrometer metallization
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Materials Reliability in Microelectronics III
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Advanced Ta-based diffusion barriers for Cu interconnects
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Stress-induced phenomena in metallization
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Electrotransport in metals and alloys
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Electromigration and electronic device degradation
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Electro-Diffusion of Ions (Studies in Applied and Numerical Mathematics)
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Materials Reliability Issues in Microelectronics
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Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging
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